|
FABRICATION
Tolerance on overall dimensions: +/-.005” |
Minimum inside radius: .015” |
Scoring, In-board Beveling, Beveling |
Countersinking, Counter-boring, Edge Milling |
SHOP TOLERANCE
|
Standard |
Advanced |
Minimum Outer Line
|
.004” |
upto .002” |
Minimum Inner Line Width |
.004” |
upto .002” |
Minimum Outer Space, Trace/ Trace |
.004” |
upto .002”, |
Minimum Inner Space, Trace/ Trace |
.004 |
upto .002” |
Minimum Outer Space, Trace/ Pad |
.004” |
upto .002 |
Minimum Inner Space, Trace/ Pad |
.004” |
upto .002” |
Minimum Space, PCB Edge To Conductor |
.010” |
upto .008” |
Layer to Layer Registration |
+/- .005” |
.003” |
Finished PCB Thickness |
.005” - .125” |
.126” - .250” |
Board Thickness Tolerance |
+/- 10% |
+/- 5% |
Dimensions – Hole Location |
+/- .003” |
+/- .003 |
Dimensions – Fab O.D. |
+/- .005” |
+/- .004” |
Fabrication Radius |
+/- 5 Deg |
+/- 5 Deg |
Warpage (inch per inch) |
.007” |
upto .005” |
Minimum Dielectric Thickness |
.004” |
upto .0015” |
Minimum Number of Layers |
20 |
30 |
Minimum Core Thickness |
.004”-.005” |
.002” |
PAD TO HOLE SIZE
|
Standard |
Advanced |
Drilled Hole |
.018” |
.016” |
Minimum Plated Hole Size* (VIA) |
|
|
(Finished) |
/- .008” |
.006” |
Tolerance – Plated Hole Size |
+/_ .003” |
+/- .002” |
Minimum Annular Ring – Outer Layer |
.005” |
.003” |
Minimum Annular Ring – Inner Layer |
.004” |
.002” |
DRILLING
|
Standard |
Advanced |
Maximum Aspect Ratio |
6:1 |
12:1 |
Universal Grid Tester |
(UGT) |
.030”.020” |
Flying Probe Testing |
Minimum Pitch: 004” |
Minimum Feature Size: .0015” |
SOLDER MASK CRITERIA
|
Standard |
Advanced |
SMT Minimum Pad Spacing |
008” |
Up to .006” |
Line to Minimum Space |
005” |
Up to .003” |
Minimum Solder Mask Rib |
004” |
003” |
SURFACES FINISHES AVAILABLE
|
Standard |
Advanced |
HASL Minimum Thickness |
0003” |
Up to .0005” |
HASL Maximum Thickness |
0015” |
up to .001” |
Electrolytic Hard Gold |
0 µ in |
call for info |
Maximum Thickness |
|
|
Electrolytic Soft Gold |
0 µ in |
call for info |
Maximum Thickness |
|
|
Electroless Gold |
0 µ in |
call for info |
Maximum Thickness |
|
|
Immersion Gold Thickness |
- 8 µ in |
2 – 8 |
Immersion Silver Thickness |
- 5 µ in |
3 – 5 µ in |
Immersion Gold Thickness |
0 - 50 µ in |
30 - 50 µ in |
OSP |
C-Planarity=Copper Plate |
C-Planarity=Copper Plate |
ELECTRICAL CHARACTERISTICS
|
Standard |
Advance |
Impedence Tolerance |
+/- 10% |
+/-8% |
MATERIALS AVAILABLE
|
Standard |
Advance |
FR-4 Standard Multifunctional |
Yes |
140 |
FR-4 High Tg |
Yes |
170 – 180 |
Getek |
Yes |
170 |
ADI 408 |
Yes |
180 |
Polymide |
Yes |
230 – 280 |
BT Epoxy |
Yes |
180 |
Cyanate Ester |
Yes |
250 |
Duroids |
|
Call for information |
Teflons |
|
Call for information |
Rogers |
|
Call for information |
Taconics |
|
Call for information |
Arlon |
|
Call for information |
|