Fineline Circuits & Technology: Capabilities

MATERIAL	COPPER CLADDING	LAYERS	DRILLING
FINISH	SOLDERMASK	FABRICATION	TESTING

DRILLING

Minimum mechanical drilled hole size:		.005”
Minimum slot width size:		.020”

	.Unplated	Plated
<.040	+/- .001	+/- .002
.040”-.093”	+/- .0015”	+/- .003”
.094”-.257”	+/- .002”	+/- .004”
>.257”	+/- .003”	+/- .004”
Minimum distance, edge to edge, from plated hole to internal circuitry or plane:		.008”
Minimum distance, edge to edge, from non-plated hole to circuitry:		.010” internal / .007” external
Standard finished minimum annular ring if not specified otherwise:		.001”
Minimum signal pad must be larger than drilled hole diameter:		.015” internal / .012” external
Minimum plane clearance must be larger than nominal finished hole		.025”
Tighter annular ring is possible with tolerance or by reducing finished annular ring requirements.
Plasma desmear + etch back available

Finish

Maximum Hole Aspect Ratio: 12:1

(SMOBC) Solder mask over bare copper, HASL

SMOBC with OSP, Enthone Cu56, Cu106a

Immersion gold, selective or full body

Elctroless gold full body

Electrolytic gold, selective or full body

Immersion silver

Multiple surface plating available

Note: Other finishers are available.

SOLDERMASK /LEGEND

Per IPC-SM-840

Wet types: SR1000, SR1020

Photo- imageable types: (LPI)

Dry Film types: Dupont Vacrel, 8000 series

Soldermask colors: Red, Green, Blue, Black, Clear, Purple

Minimum clearance pad edge to clearance edge: LPI-.002”, Dry Film-.003”, Wet Mask-.005”

Legend colors: White, Yellow, Black, Red, Orange

Via fill: Silver Epoxy (Thermal)