Fineline Circuits & Technology: Capabilities

MATERIAL	COPPER CLADDING	LAYERS	DRILLING
FINISH	SOLDERMASK	FABRICATION	TESTING

Inner layer copper cladding

Maximum cu weight planes:	10 oz
Maximum cu weight signals:	5 oz
Minimum cu weight:	1/4 oz

Outer layer copper cladding

Maximum cu weight:	10 oz
Minimum cu weight:	1/4 oz
Maximum Active Board Size:	24”*36”

ETCHING

Minimum conductor width:	.002”
Minimum feature spacing:	.002”

LAYER CONSTRUCTIONS / IMPEDENCE DESIGN

Minimum core thickness:	.002”
Minimum dielectric:	.002”

Impedance stack-up design and verification service
Buried and blind vias
Sequential lamination construction
Buried capacitance
Finished impedance tolerance of +/- 10%
Note: Tighter tolerances are available

LAMINATION

Maximum number of layers:	30
Maximum board thickness:	.400”
Panel Thickness Tolerances
.015”-.030”	+/- .003”
.031”-.080”	+/- .005”
.081-.125”	+/- .008”
>.125”	+/- 10%

Note: Tighter tolerances are available