www.finelinecircuits.com
Layer Constructions
•Minimum core thickness down to .002”
•Minimum dielectric down to .002”
•Impedance stack-up design and verification service
•Buried and blind vias with
sequential lamination
•Buried capacitance
•Note: Tighter tolerances are available
•Panel Thickness Tolerances
•
•.015”-.030”   +/- .003”
•.031”-.080”   +/- .005”
•.081-.125”    +/- .008”
• >.125”   +/- 10%