1	FINE LINE CIRCUITS & TECHNOLOGY, INC A Fine Technology Group
2	Representative Presentation Snapshot: Fine Line Circuits & Tech. is privately held company, A Fine Technology Group, which includes PCB design, manufacturing, assembly, packaging and industrial metal finish company All divisions are Southern California based Total manufacturing space for all operations is around 97,000 square feet Fine Line Circuits & Tech. has manufacturing space of around 20,000 square feet Markets served: Military / Aerospace Telecom / Datacom Medical Security / Networking Process Automation Data Storage Test / Measurement Consumer Electronics
3	A Fine Technology Group Fineline Circuits and Technology Fine Design Fine Pitch and Assembly Fine Electronic Assembly Pacific Plating Vector Electronics Complete in-house commercial & military Multilayer PCB fabrication PCB Lay out and Electronic Design “In house” SMT & Thru Hole Component Assemblies & Turnkey Production Cable & Wire Harness, Integration Assembly Services Complete Electroplating and Industrial metal finish Systems Packaging (Backplanes – VME, cPCI, Enclosures, sub racks) from prototype to production.
4	Introduction Founded 1978 Well known in industry Capabilities include Flex Circuits Rigid PCB’s Prototype Small Volume High Volume Noted for unsurpassed quality, service and on time delivery
5	Fineline – First choice First choice for commercial and military grade Printed Circuit Boards First choice for high quality, fast turn, cost competitive prototypes and customer satisfaction Fineline Circuits & Tech. is MIL-PRF-55110, UL and ISO 9002 certified State of the art technology & equipment to produce finest Printed Circuit Boards Technology includes down to 2 mil Line & Space with micro Via Holes
6	Top Quality & Quick turn Laminate per MIL-P-13949, IPC-4101 FR-4 laminates, performance laminates, high performance epoxy-based laminates, high frequency laminates, microwave laminates Superior Quality PCBs delivered on time Boards up to 30 layers in Quick turn, from 24 hrs to standard lead time
7	Copper Cladding Inner layer copper cladding: Maximum cu weight on planes up to 10 oz Maximum cu weight on signals up to 5 oz Minimum cu weight down to 1/4 oz Outer layer copper cladding Maximum cu weight up to 10 oz Minimum cu weight down to 1/4 oz Maximum Active Board Size up to 36” ETCHING Minimum conductor width down to .002” Minimum feature spacing down to .002”
8	Layer Constructions Minimum core thickness down to .002” Minimum dielectric down to .002” Impedance stack-up design and verification service Buried and blind vias with sequential lamination Buried capacitance Note: Tighter tolerances are available Panel Thickness Tolerances .015”-.030” +/- .003” .031”-.080” +/- .005” .081-.125” +/- .008” >.125” +/- 10%
9	Laser Photo Plotter Artwork is exposed to Laser Photo Plotter to Develop the film Rinse Dry In house facilities to perform all the operations involved for development of films
10	Drilling Drill precision down to 4 mil (minimum) Drill bits changed after every 1000 holes Highest quality and highest standards Undertake military specifications even for commercial jobs to perform best in quality
11	Plating Facility In house high standard facilities for electroless and electrolytic processes Inspections are performed at every stage to make sure every process is verified against data
12	Inspection/LAB Facilities INSPECTION IS PERFORMED AT ALL STAGES
13	Testing Facilities Flying Probe Testing Machine (EMMA)
14	Testing Facilites [2] PIN TESTING (Bed of Nail Testing) – for thru hole
15	Final Fab Routing Machine for final fabrication of boards
16	Sales Forecast Projected Revenue Goals & Forecast of Fineline Circuits & Tech.
17	Business Strategy WIN-WIN You win, Fineline wins.